中文规范称号: 半导体器件.机器以及气象实验办法.第11局部: 温度的急速变动.双液电镀槽法

　　替代规范号: IEC 47/1535A/CDV-2000;IEC 47/1605/FDIS-2002;IEC 60749-1996;IEC 60749 AMD 1-2000;IEC 60749 AMD 2-2001;IEC 60749 Edition 2.2-2002;IEC/PAS 62185-2000,

　　规范简介:

　　defines the rapid change of temperature test method and the two-fluid-bath method. this test method may also be used, employing fewer cycles, to test the effect of i妹妹ersion in heated liquids that are used for the purpose of cleaning devices. this test is applicable to all semiconductor devices. it is considered destructive unless otherwise detailed in the relevant specification.

　　中国规范分类号: L40